Hughes Circuits

N4000-29 from Nelco

The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (3185°C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PWB designs, but for today’s toughest, high-performance, lead-free applications.

Key Features of N4000-29

  • Low Z-axis expansion
    Reduced expansion improves through-hole reliability
    Excellent for high layer count assembilies
    Designed to withstand multiple reflow excursions and repair operations
  • High Tg, excellent thermal stability and moisture resistance
    Improved lead-free assembly compatibility
    Proven IST testing results
    Exceptional peel strength
    Suitable for high-layer count, sophisticated PWB designs
  • CAF Resistant
    Providing long term reliability in end products
  • Proprietary resin chemistry
    Extremely low Z-CTE
    Improved thermal stability, CAF and moisture resistance when compared to traditional FR-4
  • Superior electrical properties
    Supporting advanced technology PWB designs
  • Optimized FR-4 processing
    Superior rheology providing consistent controlled flow and superior via topography
    75 min press at 185°C and 200-300 psi

Applications for N4000-29

  • Advanced Lead-Free Assembly Substrate
  • Large Format Backplanes
  • Tight Tolerance Via to Via Applications
  • High I / O Count BGA Substrates
  • Extreme Layer Count Multilayers
  • Lead-Free DCA Applications
  • High Temperature Underhood Automotive
  • Telecommunications Infrastructure
  • Sophisticated Data Storage Applications

Links for N4000-29

Nelco's Datasheet for N4000-29

 

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