N5000 from Nelco
The Nelco N5000 BT epoxy laminate and prepreg system provides superior electrical properties. The N5000 resin system was originally developed for application specific use in high density military and commercial boards requiring not only close thickness tolerance, but also the ability to withstand the stress of multiple soldering excursions and repeated chemical exposure.
Key Features of N5000
- BT resin chemistry
BT (bismaleimide triazine) provides low Dk and Df values and overall superior electrical properties - Excellent Reliability and Performance
Can be used in lead-free assembly applications and designs
Tg 185°C by DSC
Low Dk and Df
Reduced X/Y and Z-Axis expansion - CAF Resistant
Low Z-CTE and proven CAF resistance provide long-term reliability - Wide processing latitude
Unique BT / epoxy blend results in a wide processing latitude
90 min press at 190°C and 200-350 psi
Applications for N5000
- Fine-Line Multilayers
- Backplanes
- Surface-Mount Multilayers
- MCM-Ls
- Direct Chip Attach
- Wireless Communications
- High Density Interconnects
