N5000-30 (Prepreg) and N5000-32 (Laminate) from Nelco

The Nelco N5000­30 prepreg and N5000­32 laminate BT epoxy materials are designed specifically to meet or exceed new and emerging chip­packaging requirements. The primary applications of these materials include high performance interconnects that form the circuitry inside plastic BGAs, PBGAs and LGAs.

Key Features of N5000-30 and N5000-32

• BT Resin Chemistry
  BT (bismaleimide triazine) provides low Dk and Df values and overall superior electrical properties
• Excellent Reliability and Performance
  Can be used in lead-free assembly applications and designs
  Tg 205°C by DSC
  Low Dk and Df
  Reduced X/Y and Z-Axis expansion
  Provides Excellent wire bondability
• Chip Packaging Options
  The Nelco N5000-30 is offered as a prepreg to be used as a build-up for multilayer applications and is a natural color, high performance, dimensionally-stable BT material
  The Nelco N5000-32 is a black laminate suitable for doubled-sided PBGA applications and multilayer packages in conjunction with N5000-30 prepreg
  A reduced flow version is also available

Applications for N5000-30 and N5000-32

• BGA Multilayers
• PBGA
• LG
• PCMCIA
• MCM-Ls
• Direct Chip Attach
• JEDEC Conforming Packages

Links for N5000-30 and N5000-32

Nelco's Datasheet for N5000-30 and N5000-32