N7000-1 from Nelco
The Nelco N7000-1 series of polyimide laminate and prepreg has a low Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for applications requiring the superior thermal stability and chemical resistance provided by a polyimide.
Key Features of N7000-1
- Polyimide resin chemistry
Robust thermal stability and reliability
High temperature tolerance and chemical resistance - Lead-free assembly compatibility
Withstands multiple thermal excursions
Tg 260°C by DSC
Low Z-Axis CTE
Designed for use in severe conditions - Supports current and previous military and industrial standards
Meets UL 94 HB and IPC-4101/40, /41 and /42 specifications
Complies with the old GIJ and GIL military specifications - Reliable plated-through holes
Low Z-axis CTE providing good dimensional stablity
Specially-treaed copper for enhancing peel strength and bond integrity - Proven processing and performance
Proven performer with well-known processing characteristics
Wide processing window
Applications for N7000-1
- Fine-Line Multilayers
- Backplanes
- Surface-Mount Multilayers
- BGA Multilayers
- MCM-Ls
- Direct Chip Attach
- High Speed Computing
- Burn-in Boards
