Hughes Circuits

Home Materials Nelco Materials N7000-2 HT & N7000-3

N7000-2 HT (Laminate) and N7000-3 (Prepreg) from Nelco

The Nelco N7000­2 HT laminate and N7000­3 prepreg are a series of toughened polyimide materials for use in high­reliability multilayers. This combined resin system provides excellent thermal performance, improved processing characteristics and is exceptional for use in a wide variety of applications that include fine geometry multilayer constructions and extreme reliability requirements.

Key Features of N7000-2 HT and N7000-3

  • Polyimide resin chemistry
    Robust thermal stability and reliability
    Toughened resin system
    High temperature tolerance and chemical resistance
  • Lead-free assembly compatibility
    Withstands multiple thermal excursions
    Tg 260°C by DSC
    T260 > 12 minute
    Low Z-Axis CTE
    Designed for use in severe conditions
  • Supports current and previous military and industrial standards
    N7000-2 HT and N7000-3 meet IPC-4101/40. /41 and/42 specifications
    Complies with the old GIJ and GIL military specifications
  • Reliable plated-through holes
    Low Z-Axis CTE and toughened polyimide chemistry providing good dimensional stability
  • Reliable processing
    Improved fracture resistance compared with traditional polyimide systems
    Reduced cure time compared to other traditional polyimide systems

Applications for N7000-2 HT and N7000-3

  • Fine-Line Multilayers
  • Backplanes
  • Surface-Mount Multilayers
  • BGA Multilayers
  • Direct Chip Attach
  • Underhood Automotive
  • Burn-in Boards

Links for N7000-2 HT and N7000-3

Nelco's Datasheet for N7000-2 HT and N7000-3

 

Request a Quote


Click here
to send us your technical requirements for a quote request.

 

Press Releases

tn4
Review news and announcements from HCI.

Certifications

tn5
HCI is committed to ongoing quality control.

 

Support

tn2
Select an option below for support.

 

 

Contact Informaion

tn3