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TMM Thermoset Microwave Laminates

TMM® Thermoset Microwave Laminates from Rogers

Rogers TMM® 3, TMM 4, TMM 6, TMM 10 and TMM 10i thermoset microwave laminates combine low thermal coefficient of dielectric constant, a copper matched coefficient of thermal expansion and the best dielectric constant uniformity of any substrate in the market. Due to their electrical and mechanical stability, TMM high frequency laminates are ideal for high reliability stripline and microstrip applications. When compared to alumina substrates, TMM laminates offer key fabrication advantages since it is available copper clad in larger formats, allowing the use of standard PCB subtractive processes.

Features of TMM® Thermoset Microwave Laminates

Wide range of dielectric constants. Ideal for single material systems on a wide variety of applications.
Excellent mechanical properties. Resists creep and cold flow.
Exceptionally low thermal coefficient of dielectric constant.
Coefficient of thermal expansion matched to copper - high reliability of plated through-holes.
Resistant to process chemicals. No damage to material during fabrication and assembly processes.
Thermoset resin for reliable wirebonding. No specialized production techniques required. TMM 10 and 10i laminates can replace alumina substrates.
RoHS compliant, environment friendly.