fastRise™ Multilayer Non-Reinforced Prepreg
fastRise™27 is designed to eliminate skew in differential transmission lines and eliminate dielectric constant fluctuations caused by fiberglass in filter and coupler applications. This low temperature thermosetting prepreg is based on ceramic, thermoset and PTFE and is ideal for use with Taconic's standard low loss laminates like TSM-29.
For applications that require low loss at high frequencies, fastRise™27 prepreg offers design engineers the properties needed for superior performance. The low 0.0017 Df at 40 GHz enables the production of mmWave multilayer PWBs. In addition, the low 420 F (215 ºC) lamination temperature enables sequential laminations to be performed at lower temperatures than those normally used for FEP and PFA in military constructions.
Characteristics of fastRise™27
- Low Dk enables reduced thickness of ATE boards
- Low temperature alternative to thermoplastic films in military designs
- Multilayer prepreg for mmWave applications
- Stable Dk over temperature
- Fiberglass free prepreg
- Laser ablatable
Applications for fastRise™27
- Semiconductor testing
- Military
- mmWave antenna/automotive
Links for fastRise™27
Taconic's Product Page for fastRise™27
Taconic's Data Sheet for fastRise™27
fastRise is a trademark of Taconic
