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TSM-DS

TSM-DS Dimensionally Stable Low Loss Laminate

TSM-DS is a thermally stable, industry leading low loss core (DF= 0.0010 at 10 GHz) that can be manufactured with the predictability and consistency of the best fiberglass reinforced epoxies. TSM-DS is a ceramic-filled reinforced material with very low fiberglass content (~5%) that rivals epoxies in fabricating large format complex multilayers.

TSM-DS core combined with fastRise™27 (DF = 0.0017 at 40 GHz) prepreg is an industry leading solution for the lowest possible dielectric losses that can be attained at epoxy-like 390 - 420˚F (200 - 215˚C) fabrication temperatures. The low insertion losses of TSM-DS/ fastRise™27 are only rivaled by fusion bonding (the melting of pure Teflon® laminates from 550 - 650˚F [288 - 343˚C]). Fusion bonding is expensive, it causes excessive material movement and it puts stress on plated through holes. For complex multilayers, the price of poor yield drives up the final material costs. fastRise™27 enables the sequential lamination of TSM-DS at low 390 - 420˚F (200 - 215˚C) with consistency and predictability that reduces cost.

For microwave applications, the low x, y and z CTE values ensure that critical spacings between traces in filters and couplers have very low movement with temperature. TSM-DS can be used with very low profile copper foils yielding a clear copper edge between coupled lines.

Registration over many layers is critical for yield and variations in copper weight and copper etching across a panel can cause non-linear movement. Non-linear movement over large panels leads to a lack of registration at the pad level and possibly open circuits. Industry standard epoxy material requires scaling factors around 0.5 mil/inch in the X and Y directions to compensate for material movement during fabrication. Taconic’s TSM-DS demonstrates dimensional movement from 0.2 - 0.4 mil/inch (270 mil thick, 21”x27” hybrid PWB developed in collaboration with Harbor Electronics), enabling the predictable fabrication of complex hybrid PWBs.

TSM-DS is compatible with Ticer and Ohmega resistor foils.