Hughes Circuits will be at the 59th
International Microelectronics Assembly and Packaging Society 

We will be on-site to answer questions about Wire bonding and packaging on Sept 30- Oct 1, 2026, Booth# 12053 

The 59th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.

Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with emphasis on Advanced Package Structures (Heterogeneous Integration, HPC, AI); Advanced Interconnect, Bumping & Bonding Technologies; High Reliability, RF/MW, MEMS/Sensors/Flexible, WLCSP, FOWLP, Novel SIP Structures, EV/eVTOL; Enabling Materials & Advanced Equipment and Processes; and Design & Modeling, AI Enablement, CPI and Metrology. 

Conference: September 28 - October 1
Professional Development Courses: September 28
Conference Technical Program: September 29 - October 1
Exhibition: September 29 - September 30

All Symposium sessions will take place at the Encore Boston Harbor.

Don't forget to stop by and visit us at the booth# 12053

For more information on the IMAPS 2026, check out their website: https://imaps.org/page/IMAPS-Symposium

 

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